Electrically conductive pastes
Conductive pastes are based on silver nanoparticles. Paste contains properly selected organic carrier, less than 20nm grain size silver nanoparticles and thinner.
Addition of organic carrier and nano-sized particles allows us to significantly lower the temperature of silver composite sintering relative to commonly used silver microparticles and enamel phase based pastes.
The sintering temperature of common silver micropowder based pastes with addition of enamels which make sintering easier ranges from 600 to 850°C, depending on the type of enamel. The melting temperature of silver nanoparticles which are less than 100nm falls in the range up to 200-350 °C.
SIlverCon conductive pastes can be applied by common printing techniques used in conductive paths and layers production. They are perfect for screen printing and gravure printing. High tolerance of rheology allows us to choose the proper viscosity, wettability and formability according to chosen printing technique.
High surface adhesion and low sintering temperature make using them in printed electronics possible. Pastes can also find applications in assembling of electronic components to the ground. Their main advantage is possibility to achieve 0.5 - 5μm thick layer after sintering.
Water based paint
Spray gun application
Layer thickness from 1 to 30 micrometers
Sintering the layer with a burner
One-staged layer burning
Two-staged layer burning
Sintering the layer in the furnance
Adhesion compatibile with ISO 2409
Layer thickness from 0.5 to 5 micrometers
Helioenergia sp. z o.o.
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